From my Intel days alternating between microprocessor architectures with IC design and then it's low yield root cause analysis debug, one of the major factor to early silicon IC failure is increased (and sometimes runaway) leakage current over time due to thermal stress on the P N junction. With increased leakage current, it in turn causes more heat and more heat results in even greater leakage current. This is one of the reason Intel shifted from P4 architecture to iCore architecture but I won't go into too much details. The same heat and leakage current is also a major cause of LED diode failure and decrease efficiency/intensity. There are many consideration and trade offs are made in designing a new LED fixture. Example of some trade off are between cost and aesthetic to cooling performance and size. Cree states that with their XPE2 LED diodes, system designer can operate their LED above 100C but operation life/intensity will degrade in their longevity datasheet. With ReeFi Duo series, I've incorporate many aspects of CPU heatsink design such as high active cooling surface area, copper heat spreader, vapor cooling chambers to achieve over 9 sq-ft of active cooling surface area (10x more than others) and able to maintain LED diode junction temperature below 75C even at constant full power of 216 watts. To achieve this, there are some trade offs such as higher development and production cost, much heavier unit, and slightly thicker in size. I feel like I have achieve great balance of size and aesthetic to performance but with increased weight.